Effects of Additional Elements on the Grain Boundary Reaction in a Cu-2 mass%Be Alloy
Author:
Affiliation:
1. Department of Materials Science, Himeji Institute of Technology
2. Faculty of Engineering, Osaka University
3. Teikoku Women’s College
Publisher
Japan Institute of Metals
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/matertrans1960/24/10/24_10_674/_pdf
Reference28 articles.
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2. 2) M. Nakayama: Japan J. Appl. Phys., 4 (1965), 760.
3. 3) S. Yamamoto and Y. Murakami: Mem. Fac. Eng., Kyoto Univ., 31 (1969), 576.
4. 4) S. Yamamoto, M. Matsui and Y. Murakami: Trans. JIM, 12 (1971), 159.
5. 5) V. A. Phillips and L. E. Tanner: Acta Met., 21 (1973), 441.
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1. Influence of Grain Size and Quenching Rate on the Age-Hardening Behavior of Cu-2%Be Alloy;Materials Transactions, JIM;1998
2. Effect of Quenching Temperature on the Intragranular and Cellular Precipitations in Cu-1.5%Be Binary Alloy;Materials Transactions, JIM;1995
3. Effects of Co, Ni and Ti Additions on the Cellular Precipitation in Cu-2%Be Alloy;Materials Transactions, JIM;1994
4. Influence of Solution-Treatment Conditions on the Cellular Precipitation in Si-Doped Cu–10Ni–8Sn Alloy;Materials Transactions, JIM;1991
5. Effect of Si Addition on the Cellular Precipitation in a Cu–10Ni–8Sn Alloy;Materials Transactions, JIM;1990
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