Solderability of Bulk Metallic Glasses Using Lead-Free Solders
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Graduate School of Engineering, Osaka University
3. Institute for Materials Research, Tohoku University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/50/6/50_ME200824/_pdf
Reference19 articles.
1. 1) A. Inoue: Acta Mater. 48 (2000) 279–306.
2. 2) A. Inoue: Mater. Sci. Eng. A 304–306 (2001) 1–10.
3. 3) A. Inoue and A. Takeuchi: Mater. Trans. 43 (2002) 1892–1906.
4. 4) C. Qin, K. Asami, T. Zhang, W. Zhang and A. Inoue: Mater. Trans. 44 (2003) 749–753.
5. 5) H. Men, S. J. Pang and T. Zhang: Mater. Sci. Eng. A 408 (2005) 326–329.
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