Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature-Reference-Cited by-同舟云学术

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

Published:2019-06-01 Issue:6 Volume:60 Page:909-914
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Hirai Yukihiko¹²,Oomori Kouki²,Morofushi Hayato²,Shohji Ikuo¹

Affiliation:

1. Division of Mechanical Science and Technology, Faculty of Science and Technology, Gunma University

2. Keihin Corporation

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/60/6/60_MH201807/_pdf

Reference16 articles.

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2. 2) Y. Takahashi and I. Shohji: Proc. 21st Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2015) pp. 165–168.

3. 3) F. Takenouchi and A. Yamauchi: Proc. 21st Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2015) pp. 153–158.

4. 4) S.A. Belyakov, J. Xian, G. Zeng, K. Sweatman, T. Nishimura, T. Akaiwa and C.M. Gourlay: J. Mater. Sci. doi:10.1007/s10854-018-0302-8.

5. 5) M.M.R. Chowdhury, S. Ahmed, A. Fahim, J.C. Suhling and P. Lall: Proc. 15th IEEE ITHERM Conference, (2016) pp. 1202–1208.

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