Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling-Reference-Cited by-同舟云学术

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints during Thermal Cycling

Published:2013 Issue:5 Volume:54 Page:796-805
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Hamada Naoyuki¹,Uesugi Tokuteru²,Takigawa Yorinobu²,Higashi Kenji²

Affiliation:

1. Ishikawa Metal Co., Ltd.

2. Department of Materials Science, Graduate School of Engineering, Osaka Prefecture University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/54/5/54_MBW201206/_pdf

Reference49 articles.

1. 1) K. Suganuma: Curr. Opin. Solid State Mater. Sci. 5 (2001) 55–64.

2. 2) D. Wang, Y. Yuan and L. Luo: Mater. Trans. 52 (2011) 1522–1524.

3. 3) H. Kato and H. Kobayashi: Mater. Trans. 49 (2008) 2068–2075.

4. 4) X. Zhang, H. Matsuura, F. Tsukihashi and Z. Yuan: Mater. Trans. 53 (2012) 926–931.

5. 5) Y. Kariya, T. Morihata, E. Hazawa and M. Otsuka: J. Electron. Mater. 30 (2001) 1184–1189.

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy;Crystals;2023-11-25

2. Optimization of creep and thermal features of the Sn-Ag-Cu-Zn alloy by the magnetic field;Microelectronics Reliability;2023-04

3. Effects of Nanoparticle Addition on the Reliability of Sn-Based Pb-Free Solder Joints Under Various Conditions: A Review;Nano;2023-01

4. Effect of Gallium Addition on High-Temperature Deformation Behavior of Tin;Journal of Smart Processing;2022-09-10

5. Development of Sn Solder Plating Containing Cellulose Nanofiber;2022 International Conference on Electronics Packaging (ICEP);2022-05-11