Metal Injected Copper Carbon Nanotube Composite Material with High Thermal Conductivity and Low CTE for IGBT Power Modules-Reference-Cited by-同舟云学术

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Metal Injected Copper Carbon Nanotube Composite Material with High Thermal Conductivity and Low CTE for IGBT Power Modules

Published:2018-08-01 Issue:8 Volume:59 Page:1251-1258
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Mohammadi Farhad¹,Arab Najmeddin²,Li Sheng-Shian¹³

Affiliation:

1. Institute of NanoEngineering and MicroSystems, National Tsing Hua University

2. Department of Material Science, Islamic Azad University

3. Department of Power Mechanical Engineering, National Tsing Hua University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/59/8/59_M2018006/_pdf

Reference40 articles.

1. 1) A. Volke and M. Hornkamp: IGBT Modules Technologies, Driver and Application, (Infineon).

2. 2) M. Marz: IEEE, (2003) pp. 1196–1201.

3. 3) T. Markus, G. Thomas, W. Frank and I. Yoo: (2016) pp. 1–17.

4. 4) J. Baliga: The IGBT Device: Physics, Design and Applications of the Insulated Gate Bipolar Transistor, (2015).

5. 5) C.J. Liu, G.Q. Zhang, L.J. Emst, M. Vervoort and G. Wisse: Orlando, (2001) pp. 624–631.

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4. Copper Like Thermal Conductivity and Silicon Like Coefficient of Thermal Expansion Copper Graphene for High Power IGBT by Metal Injection Molding;MATERIALS TRANSACTIONS;2018-11-01

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