Solidification Behaviour of Rapidly Quenched Cu–Sn Alloys
Author:
Affiliation:
1. Department of Materials Processing, Royal Institute of Technology
Publisher
Japan Institute of Metals
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/matertrans1989/41/11/41_11_1575/_pdf
Reference27 articles.
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4. 4) W. W. Webb: J. Appl. Phys., 33 (1963), 3546–3553.
5. 5) S. Howe and C. Elbaum: J. Appl. Phys., 32 (1961), 742–751.
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