Dependence of Microstructural Evolution of Nanoindented Cu/Si Thin Films on Annealing Temperature-Reference-Cited by-同舟云学术

Dependence of Microstructural Evolution of Nanoindented Cu/Si Thin Films on Annealing Temperature

Published:2010 Issue:11 Volume:51 Page:2013-2018
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Lee Woei-Shyan¹,Chen Tao-Hsing²,Lin Chi-Feng³,Chuang Yu-Liang¹

Affiliation:

1. Department of Mechanical Engineering, National Cheng Kung University

2. Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences

3. National Center for High-Performance Computing

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/51/11/51_M2010212/_pdf

Reference34 articles.

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2. 2) Y. Cao, C. Kim, S. R. Forrest and W. O. Soboyejo: J. Appl. Phys. 98 (2005) 033713.

3. 3) J. Plummer, M. Deal and P. Griffin: Silicon VLSI Technology: Fundamental, Practice and Modeling, (Prentice Hall, Upper Saddle River, NJ, 2000).

4. 4) M. Gadelkak: The MEMS Handbook, (CRC Press, New York, 2002).

5. 5) T. H. Wang, T. H. Fang and Y. C. Lin: Appl. Phys. A 86 (2007) 335–341.

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