Effects of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solutions-Reference-Cited by-同舟云学术

Effects of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solutions

Author:

Suzuki Atsuhiro¹,Oue Satoshi²,Kobayashi Shigeo³,Nakano Hiroaki²

Affiliation:

1. Department of Materials Process Engineering, Kyushu University

2. Department of Materials Science & Engineering, Kyushu University

3. Department of Applied Chemistry and Biochemistry, Kyushu Sangyo University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

Reference22 articles.

1. 1) C.L. Mantell: Electrochemical Engineering, (McGraw-Hill Book Company, Inc., New York, NY, U.S.A., 1960) pp.142–167, 185–192, 210–224.

2. 2) Hitetsu Kinzoku Seiren, (Nippon Kinzoku Gakkai, Sendai, 1980) p.228, 241.

3. 3) Denki Kagaku Binran, (Denki Kagaku Kyokai, Maruzen, Tokyo,1985) pp.308–327.

5. 5) K. Shimokawa: Thesis for doctoral degree, (Kyoto University, 2013) pp.19–22.

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