Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials
Author:
Affiliation:
1. Research Center for Life Cycle Assessment, National Institute of Advanced Industrial Science and Technology (AIST)
2. Faculty of Environmental and Information Studies, Musashi Institute of Technology
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/48/8/48_MRA2006340/_pdf
Reference40 articles.
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3. 3) Danish Environmental Protection Agency: Working report No. 16, ISBN 87-7944-188-2 (2000).
4. 4) H. Wenzel, M. Hauschild and L. Alting: Environmental Assessment of Products. Vol. 1: Methodology, Tools and Case Studies in Product Development. Chapman & Hall, London. (1997).
5. 5) N. Itsubo, J. Noh and A. Inaba: Mater. Trans. 45 (2004) 3194–3200.
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