Liquidus Temperature Design of Lead-Free Solder-Reference-Cited by-同舟云学术

Liquidus Temperature Design of Lead-Free Solder

Published:2006 Issue:4 Volume:47 Page:1082-1089
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Suetsugu Kenichiro¹,Furusawa Akio¹,Tanaka Masato²,Takano Hiroaki³,Takehara Hideki⁴,Horiuchi Toshihiro⁵,Matsushige Kazumi⁵

Affiliation:

1. Jisso Core Engineering Laboratory, Corporate Production Innovation Division, Matsushita Electric Industrial, Co., Ltd.

2. Engineering Team, FA Engineering Group, Matsushita Solution Technology Company

3. Mounting Analysis Team, Manufacturing Analysis Group, Matsushita Techno Research, Inc.

4. SiP Development Section, Package Development Dept., Production Engineering Center, Corporate Manufacturing & Development Division, Semiconductor Company, Matsushita Electric Industrial Co., Ltd.

5. Graduate School of Engineering, Kyoto University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/47/4/47_4_1082/_pdf

Reference8 articles.

1. 1) K. Suetsugu: Development and Practical Application of Lead-Free Solder Bonding Technology (Materia Japan) 38 (1999) 964–967.

2. 2) A. Furusawa, K. Suetsugu and H. Yokoyama: Progress in Lead-Free Solder Technology and Applications (Matsushita Technical Journal) 49 (2003) 85–90.

3. 3) Y. Ikegami, M. Iwazumi and S. Tero: Physical Chemistry II—Thermodynamic Theory of Speed (Maruzen Publishing) (1996) pp. 78–81.

4. 4) G. Tammam: Z. Anorg. Allg. Chem. 107 (1919).

5. 5) E. C. Ban: Chem. Met. Eng. 28 (1923) 65.

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