Interfacial Microstructure of Silicon Carbide and Titanium Aluminide Joints Produced by Solid-State Diffusion Bonding
Author:
Affiliation:
1. Department of Mechanical Engineering and Systems, Graduate School of Engineering, Osaka University
2. Joining and Welding Research Institute, Osaka University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/45/8/45_8_2734/_pdf
Reference34 articles.
1. 1) K. Yamaguchi: J. High Temperature Soc. Jpn. 23 (1997) 203-208, in Japanese.
2. 2) H. Harada and T. Yokokawa: Materia Japan 42 (2003) 621-625, in Japanese.
3. 3) J.-C. Zhao and J.H. Westbrook: MRS Bulletin 28 (2003) 622-630.
4. 4) J.R. Nicholls: MRS Bulletin 28 (2003) 659-670.
5. 5) Y.W. Kim: JOM 46 (1994) 30-39.
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