Bi-Base Composite Solders for Mounting Power Semiconductor Devices-Reference-Cited by-同舟云学术

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Bi-Base Composite Solders for Mounting Power Semiconductor Devices

Published:2008 Issue:2 Volume:11 Page:141-146
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Takaku Yoshikazu,Ohnuma Ikuo,Yamada Yasushi,Yagi Yuji,Nishibe Yuji,Sutou Yuji,Kainuma Ryosuke,Ishida Kiyohito

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep1998/11/2/11_2_141/_pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pb-Free High Temperature Solder Joints for Power Semiconductor Devices;Transactions of The Japan Institute of Electronics Packaging;2009

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