Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of Photosensitve Polyimide B-stage Sheet Having High Cu Migration Resistance;Journal of Photopolymer Science and Technology;2017
2. 10.5104/jiep.13.396;Journal of Japan Institute of Electronics Packaging;2010