Fabrication of Passive Thin Film Capacitor by Using Semiconductor Technology-Reference-Cited by-同舟云学术

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Fabrication of Passive Thin Film Capacitor by Using Semiconductor Technology

Published:2005 Issue:6 Volume:8 Page:517-522
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

KOIWA Ichiro,ASHIKAGA Kinya,TERUI Makoto,SHIRAISHI Yasushi,ANZAI Noritaka,OHSUMI Takashi,OSAKA Tetsuya,KUMAGAI Tomoya,SATO Yoshimi,HASHIMOTO Akira

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep1998/8/6/8_6_517/_pdf

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Relationship between Diffusion and Adhesion Properties of Ferroelectric Thin-Film Structure on Releasable Substrate;Japanese Journal of Applied Physics;2013-06-01

2. Evaluation and Reliability Improvement Investigation of Electrical Characteristics of Ba0.9Sr0.1TiO3Dielectric Films Prepared by Electrophoretic Deposition Method;Japanese Journal of Applied Physics;2011-05-20

3. Evaluation and Reliability Improvement Investigation of Electrical Characteristics of Ba0.9Sr0.1TiO3Dielectric Films Prepared by Electrophoretic Deposition Method;Japanese Journal of Applied Physics;2011-05-01

4. Preparation and estimation of Ba0.9Sr0.1TiO3 dielectric films by EPD method with fine powder slurry;Journal of the Ceramic Society of Japan;2010

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