Temperature Prediction with Two-Resistor Model and Consideration of The Cause of Its Prediction Error

Author:

Nishi Koji1

Affiliation:

1. Embedded Sales, AMD Japan Ltd.

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Reference7 articles.

1. 1) JEDEC Standard: “Compact Thermal Model Overview,” JESD15-1, JEDEC Solid State Technology Association, 2008

2. 2) JEDEC Standard: “Two-Resistor Compact Thermal Model Guideline,” JESD15-3, JEDEC Solid State Technology Association, 2008

3. 3) JEDEC Standard: “Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board,” JESD51-8, Electronic Industries Alliance and JEDEC Solid State Technology Association, 1999

4. 4) JEDEC Standard: “Guidelines for Reporting and Using Electronic Package Thermal Information,” JESD51-12, JEDEC Solid State Technology Association, 2005

5. 6) “The worlds first combination of low-power CPU and advanced GPU intergrated into a single embedded device,” Product Brief: AMD Embedded G-Series APU Platform, Publication # 49282, 2013

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