1. 1) JEDEC Standard: “Compact Thermal Model Overview,” JESD15-1, JEDEC Solid State Technology Association, 2008
2. 2) JEDEC Standard: “Two-Resistor Compact Thermal Model Guideline,” JESD15-3, JEDEC Solid State Technology Association, 2008
3. 3) JEDEC Standard: “Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board,” JESD51-8, Electronic Industries Alliance and JEDEC Solid State Technology Association, 1999
4. 4) JEDEC Standard: “Guidelines for Reporting and Using Electronic Package Thermal Information,” JESD51-12, JEDEC Solid State Technology Association, 2005
5. 6) “The worlds first combination of low-power CPU and advanced GPU intergrated into a single embedded device,” Product Brief: AMD Embedded G-Series APU Platform, Publication # 49282, 2013