Heat Dissipation Measurement of Electronic Component on PCB by Means of External Heater and Heat Flux Sensor-Reference-Cited by-同舟云学术

Heat Dissipation Measurement of Electronic Component on PCB by Means of External Heater and Heat Flux Sensor

Published:2021 Issue:0 Volume:14 Page:E21-003-1-E21-003-10
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Li Zidi¹,Silveira Joao Vitor Thomsen¹,Fushinobu Kazuyoshi¹,Nagamizo Hiroki²,Yasui Ryuta¹,Shinoda Takuya¹

Affiliation:

1. Department of mechanical engineering, Tokyo Institute of Technology

2. DENSO CORPORATION

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/14/0/14_E21-003-1/_pdf

Reference21 articles.

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4. [4] D. Iero, et al., "A calorimetry-based measurement apparatus for switching losses in high power electronic devices," 2016 IEEE International Energy Conference (ENERGYCON), IEEE, pp. 1–5, 2016.

5. [5] V. Mattsson, "Comparison of calorimetric and electrical loss measurement methods in a frequency converter research and development application," 2011 IEEE Energy Conversion Congress and Exposition, IEEE, pp. 1026–1030, 2011.