Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints-Reference-Cited by-同舟云学术

Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints

Published:2017 Issue:0 Volume:10 Page:E16-006-1-E16-006-10
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Hine Kiyohiro¹²,Norimine Shota²,Mihara Kazuki²,Akiyama Shinnosuke¹,Furusawa Akio¹,Uenishi Keisuke²

Affiliation:

1. Production Engineering Laboratory, Manufacturing Technology and Engineering Division, Panasonic Corporation

2. Management of Industry and Technology, Graduate School of Engineering, Osaka University

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/10/0/10_E16-006-1/_pdf

Reference19 articles.

1. [1] Denso Car Electronics Association, "Illustrated Car Electronics Volume 1 System Edition," Nikkei Business Publications Inc., 2010.

2. [2] Japan Electronics & Information Technology Industries Association, "Japan Jisso Technology Roadmap 2015," Japan Jisso Technology Roadmap Committee, 2015.

3. [3] S. Sakatani, K. Hine, T. Nakamura, H. Kitaura, M. Mori, A. Furusawa, and K. Uenishi, "Explanation for Superiority of Thermal Fatigue Characteristics of Sn-3.5Ag-0.5Bi-6In Solder," Journal of Smart Processing, Vol. 4, No. 5, pp. 254-259, 2015.

4. [4] K. Hine, T. Nakamura, S. Sakatani, M. Mori, H. Kitaura, A. Furusawa, and A. Yamaguchi, "Research on Mechanism of Thermal Fatigue Properties for Sn-Ag-Bi-In Solder," 17th Symposium on Microjoining and Assembly Technology in Electronics, pp. 165-170, 2011.

5. [5] K. Hine, S. Sakatani, M. Mori, H. Kitaura, and A. Furusawa, "Research on Effects of Solid Solution on Thermal Fatigue of Lead-free Solder," 19th Symposium on Microjoining and Assembly Technology in Electronics, pp. 61-64, 2013.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and Thermal Cycle Reliability of Sn–Ag–Cu–In–Sb Solder Joint;MATERIALS TRANSACTIONS;2022-07-01

2. Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder;Materials Science Forum;2021-01-05