Effects of Internal Stress of Electroless Nickel Plating on Solder Joining Strength
Author:
Affiliation:
1. Dept. of Mechanical Engineering, Faculty of Engineering, Hokkaido University of Science
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiepeng/8/1/8_1/_pdf
Reference7 articles.
1. [1] K. Tajima, "ENEPIG as Final Finish Plation on Printed Wiring Board and Package Substrate," J. Surf. Finish. Soc. Jpn, Vol. 62, No. 8, pp. 387-391, 2011.
2. [2] Y. Ejiri, T. Sakurai, Y. Arayama, K. Suzuki, Y. Tsubomatsu, S. Hatakeyama, et al., "Electroless Ni/Pd/Au Plating for Semiconductor Package Substrates (I) - Influence of the Electroless Ni Plating Thickness on the Solder Ball Joining Reliability -," The Journal of The Japan Institute of Electronics Packaging, Vol. 15, No. 1, pp. 82-95, 2012.
3. [3] K. Iwamatsu, K. Otsuka, and K. Naito, "The internal stress of Electroless Deposits," J. Surf. Finish. Soc. Jpn, Vol. 43, No. 7, pp. 656-666, 1992.
4. [4] B. Stein, "Fast and Accurate Deposit Internal Stress Determinartion," Proc. AESF Electroforming Symposium, 1996.
5. [5] G. Richardson and B. Stein, "Comparative Study of Three Internal Stress Measurement Methods," AESF Electroforming Symposium, 1997.
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