Author:
Haijima Yuki,Takagi Kazuki,Kaneda Tatsuma,Koiwa Ichiro
Publisher
Japan Institute of Electronics Packaging
Reference9 articles.
1. Wafer level chip scale packaging (WL-CSP): an overview
2. [2] Y. Haijima, K. Takagi, T. Kaneda and I. Koiwa, "Basic Research of Metallization for Semiconductor Packaging Technology", Journal of Technological Research –The College of Engineering, Kanto Gakuin University, to be published (2009).
3. The Nucleation with SnCl[sub 2]-PdCl[sub 2] Solutions of Glass Before Electroless Plating
4. Adhesion of Electroless Nickel Plating on Glass.
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1 articles.
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