Applying Copper-Ball Dissolution for Prolonging Life of Electroless-Copper-Plating Solution-Reference-Cited by-同舟云学术

Applying Copper-Ball Dissolution for Prolonging Life of Electroless-Copper-Plating Solution

Published:2016 Issue:0 Volume:9 Page:E16-001-1-E16-001-10
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Kanemoto Hiroshi¹,Kawamura Toshinori¹,Itabashi Takeyuki¹,Miyazaki Tomoyuki²,Kaneko Yoshihisa³

Affiliation:

1. Center for Technology Innovation - Materials Research & Development Group, Hitachi, Ltd.

2. Hitachi Automotive Systems, Ltd.

3. Department of Mechanical Engineering, Faculty of Engineering, Osaka City University

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/9/0/9_E16-001-1/_pdf

Reference16 articles.

1. [1] T. Itabashi, M. Kawamoto, and H. Akahoshi, "Improvement of Electroless Plated Films by Using Quantitative Analysis and Control of Dissolved Oxygen Concentration," Proc. of the 106th Surface Finishing Soc. Conf. of Japan, Vol. 106, pp. 37-38, 2002.

2. [2] M. A. Lipson and S. C. Davis, "Nonelectrolytic Copper Plating Bath Using the Electrolytic Dialysis Method," Vol. 23, No. 10, pp. 118-120, 1984.

3. [3] T. Murata, K. Otsuka, and M. Tadakoshi, "Characteristics of Electroless Copper Plating Liquid Using the Reverse Osmosis Membranes," Proc. of the 6th Printed Circuits Conf. of Japan, Vol. 6, pp. 103-106, 1991.

4. [4] H. Homma, T. Kohno, T. Katsuta, Y. Suzuki, and A. Takatsu, "Electroless Copper Plating Using CuO," Proc. of Symposium Electroless Deposition Metals and Alloys, pp. 211-219, 1988.

5. [5] M. Saito, "Electrode Oxidation Reaction of Formaldehyde," Kinzoku Hyomen Gijutsu, Vol. 16, No. 7, pp. 300-305, 1965.