Design and Heat-dissipation Characteristics of a Novel Spectrally Selective Thermal-radiation Material

Author:

Ito Maki1,Ando Takashi1,Maruyama Naoki2,Kobayashi Takanobu2,Takezawa Yoshitaka2

Affiliation:

1. Research & Development Group, Hitachi, Ltd.

2. Advanced Technology Research & Development Center, Showa Denko Materials Co., Ltd.

Publisher

Japan Institute of Electronics Packaging

Reference5 articles.

1. [1] Y. Sha, Y. Jhuo, K. Chen, and S. Wang, "Thermal Radiation Material for Electronic Devices Applocations," Internatinal Microsystems, Packaging, Assembly and Circuits Technology Confrence, 8th., pp. 74–77, 2013.

2. [2] T. Makino and H. Wakabayashi, "Experimental Verification of Kirchhoff's Thermal Radiation Law on Surfaces With Emittance Spectra Characterized by Optical Interference Phenomena," Internatinal Heat Transfer Conference, pp. 899–905, Mar. 2011.

3. [3] S. Tsuda, M. Shimizu, F. Iguchi, and H. Yugami, "Thermal Management Technique Using Control of Thermal Radiation Spectrum for Encapsulated Electronic Devices," IEEE Trans. On Components, Packaging and Manufacturing Technol., Vol. 5, No. 7, pp. 971–979, Jul. 2015.

4. [4] H. Wang, J. Kundu, and N. J. Halas, "Plasmonic Nanoshell Arrays Combine Surface-Enhanced Vibration Spectroscopies on a Single Substrate," Angew. Chem. Int. Ed., Vol. 46, No. 47, pp. 9040–9044, Dec. 2007.

5. [5] G. Kramm and N. Molders, "Plank's blackbody radiation law: Presentation in different domains and determination of the related constants," Journal of the Calcutta Mathermatical Society, Nov. 2009.

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