Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High Reliable Electronic/Electric Materials

Author:

Kure-Chu Song-Zhu1,Ogasawara Tohru1,Yashiro Hitoshi1,Ye Rongbin1,Hosokai Takuya1,Uchidate Michimasa1,Suziki Eiichi1,Naito Tomoyuki1

Affiliation:

1. Faculty of Engineering, Iwate University

Publisher

Japan Institute of Electronics Packaging

Reference12 articles.

1. [1] P. Mottier, LEDs for Lighting Applications, (ISTE Ltd., Great Britain and John Wiley & Sons, Inc. US, 2009), p. 111.

2. [2] L. Bornstein, Numerical Data and Functional Relationships in Science and Technology, (Springer-Verlag, Berlin, 1985) Group III, Volume 15, Subvolume b.

3. [3] X. Dong and Z. Li, "Microstructure and properties of an Al-Zn-Mg-Cu alloy pre-stretched plate under various ageing conditions," Rare Metals, Vol. 27, No. 6, pp. 652-656, 2008.

4. [4] S. H. Kee, W. J. Kim, and J. P. Jung, "Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames," Surf. Coat. Tech., Vol. 235, pp. 778-783, 2013.

5. [5] M. W. Shin, and S. H. Jang, "Thermal analysis of high power LED packages under the alternating current operation," Solid-State Electron., Vol. 68, pp. 48-50, 2012.

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