Technology and Trend Analysis on High Thermally Conductive Resin-Based Materials for the Future Semiconductor Systems-Reference-Cited by-同舟云学术

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Technology and Trend Analysis on High Thermally Conductive Resin-Based Materials for the Future Semiconductor Systems

Published:2022 Issue:0 Volume:15 Page:E21-015-1-E21-015-16
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Kanechika Yukihiro¹,Okamoto Kazuya¹

Affiliation:

1. Graduate School of Innovation and Technology Management, Yamaguchi University

Publisher

Japan Institute of Electronics Packaging

Subject

General Medicine

Link

https://www.jstage.jst.go.jp/article/jiepeng/15/0/15_E21-015-1/_pdf

Reference41 articles.

1. [1] "Efforts to Realize 5G in 2020," Ministry of Internal Affairs and Communications, p. 2, 2018 (in Japanese).

2. [2] "International Roadmap Devices and Systems (IRDS) 2021 Edition Update Executive Summary," p. 43, 2021.

3. [3] "Microprocessor Trend Data," [Online]. Available: https://github.com/karlrupp/microprocessor-trend-data, (Accessed: Dec. 2^nd, 2021).

4. [4] T. Li, J. Hou, J. Yan, R. Liu, H. Yang, and Z. Sun, "Chiplet Heterogeneous Integration Technology—Status and Challenges," Electronics, Vol. 9, No. 4, p. 670, 2020.

5. [5] I. Sugaya, M. Okada, H. Mitsuishi, H. Maeda, T. Shimoda, S. Izumi, H. Nakahira, and K. Okamoto, "High-Precision Wafer-Level Cu - Cu Bonding for 3-DICs," IEEE Trans. Electron. Devices, Vol. 62, No. 12, pp. 4154–4160, 2015.

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