Non-destructive Neutron Imaging Analysis for Small Internal Structures of Power Electronic Module-Reference-Cited by-同舟云学术

Non-destructive Neutron Imaging Analysis for Small Internal Structures of Power Electronic Module

Published:2022 Issue:0 Volume:15 Page:E21-013-1-E21-013-7
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Setoyama Daigo¹,Kimura Hidehiko¹,Isegawa Kazuhisa²,Shinohara Takenao²,Kamiyama Michiaki¹,Matsumoto Yoshihiro³,Nagai Yasutaka¹

Affiliation:

1. Materials Analysis and Evaluation Research Domain, Toyota Central Research and Development Laboratories, Inc.

2. Material and Life Science Division, J-PARC Center, Japan Atomic Energy Agency

3. Neutron Science and Technology Center, Comprehensive Research Organization for Science and Society

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/15/0/15_E21-013-1/_pdf

Reference13 articles.

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4. [4] M. Usui, T. Satoh, H. Kimura, S. Tajima, Y. Hayashi, D. Setoyama, and M. Kato, "Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding," Microel. Rel., Vol. 78, pp. 93–99, 2017.

5. [5] H. Kimura, M. Usui, M. Kamiyama, T. Asada, S. Yamaguchi, D. Setoyama, and T. Sato, "Reliability Analysis of Power Module Components by Synchrotron Radiation X-ray Laminography and Diffraction," R&D Review of Toyota CRDL, Vol. 50, No. 1, pp. 39–47, 2019.