Evaluation of Electroplating Copper Filling of a Through Silicon Via Using a Scanning-laser-beam-induced Current System
Author:
Affiliation:
1. Department of Electronics Engineering and Computer Science, Fukuoka University
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiepeng/8/1/8_103/_pdf
Reference11 articles.
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3. [3] A. J. Gonzales, "On the EBIC analysis of semiconductor devices," Annual SEM Symp. (IITRI), pp. 941-947, 1974.
4. [4] E. I. Cole Jr., J. M. Soden, J. L. Rife, D. L. Barton, and C. L. Henderson, "Novel failure analysis techniques using photon probing with a scanning optical micro-scope," Proc. Int. Reliability Physics Symp. pp. 388-398, April 1994.
5. [5] S. Ito and Y. Tando, "Failure analysis method by using different wavelengths lasers and its application," Microelectro. Reliability, Vol. 39, pp. 1015-1020, 1999.
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