SPICE Modeling of Phase Change Materials for Coupled Thermo-Electrical Simulation
Author:
Affiliation:
1. Department of Mechanical Systems Engineering, Toyama Prefectural University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/25/1/25_JIEP-D-20-00094/_pdf
Reference10 articles.
1. 1) M. Skach, M. Arora, C. H. Hsu, Q. Li, D. Tullsen, L. Tang, and J. Mars: "Thermal Time Shifting: Decreasing Data Center Cooling Costs with Phase-Change Materials, IEEE Internet Computing," Vol. 21, pp. 34–43, 2017
2. 2) 石塚 勝,福岡義孝:“相変化材を用いた高発熱パッケージ冷却技術の開発,”日本機械学会論文集 (B編),Vol. 60, No. 574, 1994
3. 3) T. Hatakeyama, K. Fushinobu, and K. Okazaki: "Electro-Thermal Analysis of Submicron Si MOSFET with Zoned Mesh Based on Semiconductor Physics Theory," Journal of Thermal Science and Technology, Vol. 3, No. 1, pp. 45–57, 2008
4. 4) 八坂慎一,篠原俊朗:“回路シミュレータ(LTspice)による電気-熱連成解析用デバイスモデルの検証,”エレクトロニクス実装学会 第34回春季講演大会予稿集,4D2-01, 2020
5. 5) T. Hatakeyama, M. Ishizuka, S. TakakuwaA, S. Nakagawa, and K. Tagahi: "Experimental and Thermal Network Study on the Performance of a Pins Studded Phase Change Material in Electronic Device Cooling," Journal of Thermal Science and Technology, Vol. 6, No. 1, pp. 164–177, 2011
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