Analysis of Intensity of Singular Stress Field at the Stepped-Lap Joint-Reference-Cited by-同舟云学术

Analysis of Intensity of Singular Stress Field at the Stepped-Lap Joint

Published:2021-09-01 Issue:6 Volume:24 Page:595-605
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Noda Nao-Aki¹,Wang Biao²,Wang Sirui²,Takaki Rei²,Sano Yoshikazu¹

Affiliation:

1. Department of Mechanical Engineering, Kyushu Institute of Technology

2. Department of Mechanical and Control Engineering, Graduate School of Engineering, Kyushu Institute of Technology

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/24/6/24_JIEP-D-21-00018/_pdf

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4. 4) Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, and R. Sidhu: "A general method ology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks," Engineering Fracture Mechanics, Vol. 131, pp. 9–25, 2014

5. 5) 安田雅昭：“電子機器用実装材料システム，”日立化成テクニカルレポート，No. 40, pp. 1–12, 2003

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