Parameter Optimization of Ultrasonic Welding of Al by Crystallographic Orientation Analysis

Author:

Ito Takashi1,Aizawa Takahiro1,Ukita Yasunari1,Sato Yutaka S.2

Affiliation:

1. Corporate Manufacturing Engineering Center, Toshiba Corporation

2. Department of Materials Processing, Graduate School of Engineering, Tohoku University

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Reference11 articles.

1. 1) Z. L. Ni and F. X. Ye: "Ultrasonic spot welding of aluminum alloys : A review," J Manuf Process, Vol. 35, pp. 580–594, 2018

2. 2) K. Yano, H. Kobayashi, J. Hiroya, Y. Kimura, H. Ikeda, and M. Shibutani: "Study on bonding progress mechanism in the ultrasonic welding of the multi laminated metal foils," 21th Symposium on "MATE," pp. 369–374, 2015

3. 3) H. T. Fujii, K. Kimura, Y. S. Sato, and H. Kokawa: "Microstructure and mechanical properties of ultrasonic weld between Al alloy 6061 plates," Preprints of the National Meeting of JWS, Vol. 101, pp. 126–127, 2017

4. 4) H. T. Fujii, T. Ogura, S. Saito, T. Sasaki, T. Osada, Y. Sugiyama, K. Hamada, M. Maeda, and K. Yano: "Mechanical properties and interfacial phenomena in ultrasonic welding of Al alloy," Preprints of the National Meeting of JWS, Vol. 99, pp. 308–309, 2016

5. 5) J. Xie, Y. Zhu, F. Bian, and C. Liu: "Dynamic recovery and recrystallization mechanisms during ultrasonic spot welding of Al-Cu-Mg alloy," Mater Charact, Vol. 132, pp. 145–155, 2017

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