Analysis of Electrical Resistance Behavior and Oxide Film Growth Mechanism by Low-Temperature Oxidation of Copper Wiring in Printed Circuit Boards
Author:
Affiliation:
1. Process Development Department, Research & Development Division, Shinko Electric Industries Co., Ltd.
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/25/6/25_JIEP-D-22-00014/_pdf
Reference24 articles.
1. 1) 椙山正孝：“工業技術全書 金属材料の加熱と酸化，”誠文堂新光社，1955.11.15
2. 2) A. Rönnquist and H. Fischmeister: "The Oxidation of Copper A Review of Published Data," Journal of The Institute of Metals, Vol. 89, pp. 65–76, 1960-61
3. 3) N. B. Pilling and R. E. Bedworth: "The Oxidation of Metals at High temperature," The Journal of the Instisute of Metals, Vol. 29, No. 1, 1923
4. 4) C. Wagner: "Beitrag zur Theorie des Anlaufvorgangs," Z. physical. Chem. Abt. B., Bd. 21, Heft 1/2. 1933
5. 5) A. Dravnieks: "The Oxidation of Several Metals in Activated Oxygen at High Temperatures," Journal of the American Chemical Society, Vol. 72, pp. 3761–3767, 1950
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