10.5104/jiep.14.471-Reference-Cited by-同舟云学术

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10.5104/jiep.14.471

Published:2011 Issue:6 Volume:14 Page:471-476
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Suganuma Katsuaki,Nogi Masaya,Jiu Xinting,Tokuno Hirotake,Araki Teppei

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep/14/6/14_6_471/_pdf

Reference29 articles.

1. 1) 菅沼克昭,棚網宏:"プリンテッド.エレクトロニクス技術,"工業調査会,2009

2. Size effect on the melting temperature of gold particles

3. Novel method for room temperature sintering of Ag nanoparticle paste in air

4. Low-Temperature Wiring with Ag Nanoinks [Nanopackaging

5. 5) T. Tokuno, et al.: “Synthesis and Application of Silver Nanowires,” Proceedings in “2011 CMOS ET Meeting”

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Production of Copper Nanoparticles Dispersion Liquid Using New Copper Complex Solution;Journal of the Japan Society of Powder and Powder Metallurgy;2017

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