Dissolution Properties of Cu in Sn-Cu-Ni and Sn-Zn Lead-Free Alloys-Reference-Cited by-同舟云学术

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Dissolution Properties of Cu in Sn-Cu-Ni and Sn-Zn Lead-Free Alloys

Published:2011 Issue:5 Volume:14 Page:382-389
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Shohji Ikuo,Watanabe Hirohiko,Nagai Marie,Osawa Tsutomu

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep/14/5/14_5_382/_pdf

Reference20 articles.

1. 1) 日本電子応用電子センター編:"図解よくわかるWEEE & RoHS指令,"日刊工業新聞社,2004

2. 4) H. Nishikawa, K. Songai, and T. Takemoto: “Measurement of Erosion of Stainless Steel by Molten Lead-Free Solder Using Micro-Focus X-ray CT System,” Journal of The Japan Welding Society, Vol. 27, pp. 214s–218s, 2009

3. Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn-3Ag-0.5Cu Solder

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Small Amount of Solid Phase on Solderability in Wave Soldering Process by using of Sn-Ag-Cu-Ni Based Solder;Journal of Smart Processing;2016

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