Fabrication of Cu/Polyimide Multilayer Interconnections by Low Temperature Nanoimprint in Polyimide
Author:
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/19/1/19_46/_pdf
Reference6 articles.
1. 1) S. Y. Chou, P. R. Krauss, and P. J. Renstrom: “Imprint of sub-25 nm vias and trenches in polymers,” Appl. Phys. Lett., Vol. 67, pp. 3114-3116, 1995
2. 2) H. Komatsuzaki, K. Suzuki, Y. Liu, T. Kosugi, R. Ikoma, S.-W. Youn, M. Takahashi, R. Maeda, and Y. Nishioka: “Flexible Polyimide Micropump Fabricated Using Hot Embossing,” Jpn. J. Appl. Phys., Vol. 50, 06GM09, 2010
3. 3) B. Cui, Y. Cortot, and T. Veres: “Polyimide nanostructures fabricated by nanoimprint lithography and its applications,” Microelectron. Eng., Vol. 83, pp. 906-909, 2006
4. 4) S.-C. Park, S.-W. Youn, H. Hiroshima, H. Takagi, R. Maeda, and T. Kato: “Simplified Cu/Polyimide Damascene Approach Based on Imprint Process of Soluble Block Copolymer Polyimide,” Jpn. J. Appl. Phys., Vol. 52, 10MD03, 2013
5. 5) K. Suzuki, S.-W. Youn, S.-C. Park, H. Hiroshima, and H. Takagi: “Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process,” J. Photopolym. Sci. Technol., Vol. 27, pp. 73-80, 2014
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