Progress on Interfacial Control in Electrically Conductive Pastes
Author:
Affiliation:
1. Advanced Scientific Research Leaders Development Unit, Gunma University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/19/4/19_234/_pdf
Reference18 articles.
1. 4) J. C. Agar, K. J. Lin, R. Zhang, J. Durden, K. Lawrence, K.-S. Moon, and C. P. Wong: “Deconstructing the Myth of Percolation in Electrically Conductive Adhesives and Its Implications,” Proc. 2010ECTC, pp. 1713-1718, 2010
2. 5) J. E. Morris: “Conductive Adhesives for Electronics Packaging,” (ed. by J. Liu), Electrochemical Press, pp. 37-77, 1999
3. 6) Y. Sakaniwa, Y. Tada, and M. Inoue: “Effect of Chemical Factors on the Evolution of Electrical Conductivity during Curing in Ag-Loaded Conductive Adhesives Composed of an Epoxy-Based Binder,” Proc. ICEP2014, pp. 176-180, 2014
4. 7) Y. Sakaniwa, M. Iida, Y. Tada, and M. Inoue: “Conduction Path Development in Electrically Conductive Adhesives Composed of an Epoxy-based Binder,” Proc. ICEP2015, pp. 252-257, 2015
5. 10) Y. Sakaniwa, Y. Tada, and M. Inoue: “Evolution of electrical conductivity in silver-loaded electrically conductive adhesives composed of an amine-cured epoxy-based binder,” Mater. Trans., Vol. 57, pp. 865-872, 2016
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