High Adhesion Plating Process for ABS Resin using Ultrafine Bubble with Low Ozonated Water

Author:

Umeda Yasushi12,Nomura Taro23,Nakagawa Haruyo24,Nakabayashi Yuki23,Tashiro Katsuhiko12,Honma Hideo2,Takai Osamu23

Affiliation:

1. Kanto Gakuin University Research advancement and management organization

2. Kanto Gakuin University Materials and Surface Engineering Research Institute

3. Department of Industrial Chemistry, College of Engineering, Kanto Gakuin University

4. Ebina Denka Kogyo Co.,Ltd.

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Environmentally Friendly Plating Pretreatment for ABS Plastic Using Electrolyzed Sulfuric Acid;Transactions of the Materials Research Society of Japan;2018-12-01

2. Metal Pattern Formation using Selective UV Modification Treatment on Resins;Journal of The Surface Finishing Society of Japan;2018-02-01

3. The Surface Finishing Technologies on Printed Wiring Boards;Journal of The Surface Finishing Society of Japan;2017-09-01

4. Surface Modification of ABS Resin Using Low Concentration Ozone Fine Bubbles Dispersed in Water;Journal of The Surface Finishing Society of Japan;2017-06-01

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