Electroless Ni/Pd/Au Plating for Semiconductor Package Substrates (III) —Influence of the Electroless Pd Plating Thickness on the Solder Ball Joint Reliability and the IMC Growth

Electroless Ni/Pd/Au Plating for Semiconductor Package Substrates (III) —Influence of the Electroless Pd Plating Thickness on the Solder Ball Joint Reliability and the IMC Growth—

Published:2020-05-01 Issue:3 Volume:23 Page:230-238
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Ejiri Yoshinori¹,Sakurai Takehisa¹,Arayama Yoshinori²,Tsubomatsu Yoshiaki¹

Affiliation:

1. Hitachi Chemical Co., Ltd

2. Hitachi Chemical Techno Service Co., Ltd

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/23/3/23_230/_pdf

Reference29 articles.

1. 1) H. Yue and M. Lamson: "Effect of Plating Stubs of BGA Packages on Spurious EM Radiation," Proc. 50th Electronic Components & Technology Conference, IEEE, Las Vegas, NV, pp. 786–792, 2000

2. 2) K. Hasegawa, A. Takahashi, and A. Nakaso: "Electroless Gold Plating For Semiconductor Package Substrate," Proc. 1st IEMT/IMC Omiya Japan, pp. 230–233, 1997

3. 3) K. Hasegawa, A. Takahashi, T. Noudou, S. Nakajima, A. Takahashi, M. Nomoto, and A. Nakaso: "Electroless Ni-P/Pd/Au Plating for Semiconductor Package Substrate," Proc. SMTA International 2000, SMTA, Edina, MN, pp. 225–231, 2000

4. 5) K. Hasegawa, A. Takahashi, T. Noudou, and A. Nakaso: "Electroless Ni/Pd/Au Plating for Semiconductor Package Substrate," Plating & Surface Finishing, Vol. 91, No. 11, pp. 20–25, 2004

5. 8) Y. Ejiri, T. Sakurai, Y. Arayama, Y. Tsubomatsu, and K. Hasegawa: "Influence of Bonding Parameters on Reliability of Cu Wire-bonding to Electroless Ni/Pd/Au Plating," Proc. SMTA International 2018, SMTA, Rosemont, IL, 2018