Metallizing on Cyclo Olefin Polymer Film Using UV Irradiation as a Surface Modification
Author:
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
http://www.jstage.jst.go.jp/article/jiep/13/6/13_6_447/_pdf
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3. 3) 若林信一:"微細配線パッケージおよび基板技術の展開,"第16回エレクトロニクス実装学術講演大会講演論文集,"pp. 17–18, 2002
4. Adhesion Improvement between Conductor and Insulation Layer with Electroless Copper Plating Using Hypophosphite as a Reducing Agent.
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