Establishment of Estimate Methods on Impact Strength of Lead-Free Solder Joints in BGA Packages (2) Study of Estimate Methods on Impact Strength of Solder Joints by Interfacial Stress-Reference-Cited by-同舟云学术

Establishment of Estimate Methods on Impact Strength of Lead-Free Solder Joints in BGA Packages (2) Study of Estimate Methods on Impact Strength of Solder Joints by Interfacial Stress

Published:2010 Issue:6 Volume:13 Page:453-461
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Yaguchi Akihiro,Tanie Hisashi,Naka Yasuhiro,Yamamoto Kenichi,Kimoto Ryosuke,Ohno Nobutada

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep/13/6/13_6_453/_pdf

Reference27 articles.

1. Fall Impact Evaluating of Reliability of Solder Joints in BGA Packages Based on Surface Strain of Printed Wiring Board.

2. 2) D. Reiff and E. Bradley: “A Novel Mechanical Shock Test Method to Evaluate Lead-free BGA Solder Joint Reliability,” Proc. of 55th Electronic Components and Technology Conference, 2005, pp. 1519–1525

3. 3) 井門修,舘野正,石川重雄,伊東伸孝,三代絹子:"衝撃試験による歪評価,"日本機械学会2002年度年次大会講演論文集(VI),pp. 255–256, 2002

4. 4) T. Y. Tee, H. S. Ng, C. T. Lim, E. Pek, and Z. Zhong: “Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications,” Proc. of 53th Electronic Components and Technology Conference, 2003, pp. 121–129

5. 5) 中村佑樹,井上裕嗣,岸本喜久雄,川村法靖,川上崇:"プラスチック筐体に内蔵されたプリント基板の落下衝突挙動,"日本機械学会材料力学部門講演会講演論文集,pp. 631–632, 2003