Optical Packaging Technology for On-Board Optical Interconnection-Reference-Cited by-同舟云学术

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Optical Packaging Technology for On-Board Optical Interconnection

Published:2018-09-01 Issue:6 Volume:21 Page:542-550
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Nasu Hideyuki¹,Matsuoka Yasunobu²,Matsubara Takahiro³

Affiliation:

1. Furukawa Electric Co., Ltd.

2. Oclaro Japan, Inc.

3. KYOCERA Corporation

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/21/6/21_542/_pdf

Reference23 articles.

1. 1) Cisco Global Cloud Index: Forecast and Methodology, 2016-2021, White Paper, Jan. 2018. https://www.cisco.com/c/en/us/solutions/collateral/service-provider/global-cloud-index-gci/white-paper-c11-738085.html

2. 2) Cisco Data Center Spine-and-Leaf Architecture: Design Overview, White Paper, Mar. 2017. https://www.cisco.com/c/en/us/products/collateral/switches/nexus-7000-series-switches/white-paper-c11-737022.pdf

3. 4) SFF Committee: "SFF-8665, QSFP+ 28 Gb/s 4x pluggable transceiver solution (QSFP28)," Revision 1.9, Jun. 2015

4. 6) QSFP-DD MSA Group: "QSFP-DD specification for QSFP double density 8x pluggable transceiver," Revision 1.0, Sept. 2016

5. 7) OSFP MSA: "Specification for OSFP Octal Small Form Factor Pluggable Module," Revision 1.0, Mar. 2017

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