1. 1) http://www.hybridmemorycube.org/
2. 2) http://www.amd.com/en-us/innovations/software-technologies/hbm
3. 3) http://www.semi.org/jp/node/18331
4. 4) http://www.xilinx.com/programmable/about/research-labs/3-D_Architectures.pdf
5. 6) J. Azémar and T. Buisson: “Yole Développement Fan Out Packaging Report: Technology and Market trends 2016,” 2016 IMAPS Pasadena presentation