MCM Assembly Technology for Space Applications

Author:

Ogawa Bunsuke1,Hihara Hiroki1,Kawakami Satoko1

Affiliation:

1. NEC Space Technologies, Ltd.

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Reference7 articles.

1. 1) S. Koreeda, R. Koyama, and B. Ogawa: “Next-Generation Satellite Components Using MCM Technology,” NEC RESEARCH & DEVELOPMENT, Vol. 38, No. 3, pp. 347-352, July 1997

2. 3) D. Apollonio, et al.: “QV Band Receiver Converter for Satellite Communications,” Proceedings of the 11th European Rader Conference, pp. 360-363, Oct 2014

3. 4) J. J. Sowers, et al.: “Hardware Development for Broadband High Throughput Satellite System Utilizing Q and V-band,” the 22nd Ka and Broadband Communications Conference, Oct. 2016

4. 5) F. Finocchiaro, et al.: “Q/V band repeaters Feeder Links Demonstrator: Design, Development and Follow-on roadmap to get on the HTS/VHTS broadband communications opportunity,” the 22nd Ka and Broadband Communications Conference, Oct. 2016

5. 6) L. Devlin: “The Future of MM-Wave Packaging,” the ARMMS conference. April 2014

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