Optical and Electrical Substrate Technology
Author:
Affiliation:
1. R&D Center, Keihanna, KYOCERA Corporation
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/20/5/20_282/_pdf
Reference7 articles.
1. 3) M. Immonen, et al.: “Development of Electro-Optical PCBs with Polymer Waveguides for High-speed On-board Optical Interconnects,” Circuit World, Vol. 38, Issue 3, pp. 104-112, 2012
2. 4) M. Immonen, et al.: “End-to-end Optical 25 Gb/s Link Demonstrator with Embedded Waveguides, 90° Out-of-Plane Connector and On-board Optical Transceivers,” 42nd European Conference and Exhibition on Optical Communications (ECOC 2016), pp1154-1156, Sept. 2016
3. 5) T. Lamprecht, et al.: “Highly Reliable Silicon Based Optical Waveguides Embedded in PCBs,” Optical Fiber Communication Conference 2014 (OFC2014), Th4J.5, March 2014
4. 6) T. Lamprecht: “Advanced Packaging Technologies supporting new semiconductor application,” The 6th IEEE CPMT Symposium Japan (ICSJ 2016), I-21, Nov. 2016
5. 8) K. Nakazuru, et al.: “Development of optical multi-channel connector for rigid waveguide - Fiber optical interconnection,”Proceedings 64th Electronic Components and Technology Conference (ECTC 2014), pp. 1028-1032, May 2014
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