Packaging Architecture for Optical Interconnection and Its Prospect
Author:
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/17/4/17_275/_pdf
Reference15 articles.
1. 3) Infiniband roadmap, http://www.infinibandta.org/
2. 4) A. Narasimha, S. Abdalla, C. Bradbury, A. Clark, J. Clymore, J. Coyne, A. Dahl, S. Gloeckner, A. Gruenberg, D. Guckenberger, S. Gutierrez, M. Harrison, D. Kucharski, K. Leap, R. LeBlanc, Y. Liang, M. Mack, D. Martinez, G. Masini, A. Mekis, R. Menigoz, C. Ogden, M. Peterson, T. Pinguet, J. Redman, J. Rodriguez, S. Sahni, M. Sharp, T. J. Sleboda, D. Song, Y. Wang, B. Welch, J. Witzens, W. Xu, K. Yokoyama, and P. D. Dobbelaere: “An ultralow power CMOS photonics technology platform for H/S optoelectronic transceivers at less than $1 per Gbps,” Proc. Optical Fiber Communication Conf., Mar. 2010, Paper OMV4
3. 5) K. Schmidtke and F. Flens: “Trends and future directions in optical interconnects for datacenter and computer applications,” Proc. Optical Fiber Communication Conf., Mar. 2010, Paper OTuP4
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