Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Reference15 articles.
1. 2) R. Tummala, E. Rymaszerski, and A. Klopfenstein Editors: “Microelectronics packaging - an overview,” in Microelectronics Packaging Handbook, chapter 1, pp. 3-128, Chapman & Hall, London, U. K., 1997
2. 5) P. Garrou, and R. Tummala: “Fundamental of Wafer-level Packaging,” in Fundamentals of Microsystems Packaging, chapter 10, pp. 398-419, McGraw Hill, NY, 2001
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