1. 1) C. E. Peason, M. Met., Member.: “The viscous properties of extruded eutectic alloys of lead-tin and bismuth-tin,” J. Inst. Materials, Vol. 54, pp. 111-123, 1934
2. 2) J. Glazer: “Metallurgy of low temperature Pb-free solders for electronic assembly,” International Materials Reviews, Vol. 40, pp. 65-93, 1995
3. 3) Y. Kariya and T. Suga: “Low-cycle fatigue properties of eutectic solders at high temperatures,” Fatigue Fract Engng Mater Struct, Vol. 30, pp. 413-419, 2007
4. 4) D. R. Frear, S. N. Burchett, H. S. Morgan, and J. H. Lau: “Microstructural influences on the mechanical properties of solder,” pp. 8-11, J. W. Morris, Jr., J. L. Freer Goldstein and Z. Mei, Van Nostrand Reinhold, 1994, (The mechanics of solder alloy, 2)
5. 5) L. F. Coffin, Jr.: “A study of the effect cyclic thermal stresses on a ductile metal,” Trans. ASME, Vol. 76, pp. 931-950, 1954