1. 4) R. Iannuzzelli: “Predicting Plated-Through-Hole Reliability in High Temperature Manufacturing Processes,” Proceedings of 41st Electronic Components and Technology Conference (ECTC), pp. 410-421, 1991
2. 6) T. Y. Pan, R. P. Cooper, H. D. Blair, T. J. Whalen, and J. M. Nicholson: “Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards,” Proceedings of the ASME Winter Annual Meeting, 93-WA/EPP-12, 1993
3. A PTH Barrel Stress Distribution Model and Associated PWB Design Factors
4. 8) K. Ramakrishna, G. Subbarayan, and B. G. Sammakia: “Effect of Non-Uniformities and Defects on PTH Strain During Assembly and Accelerated Thermal Cycling,” Proceedings of Joint ASME/JSME Conference on Electronic Packaging, pp. 891-908, 1992