Coupling Device by Self-Written Waveguide Technology for Optical Interconnection between Silicon Photonics Chip and Fiber
Author:
Affiliation:
1. Department of Optical and Imaging Science & Technology, School of Engineering, Tokai University
2. Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/25/2/25_166/_pdf
Reference15 articles.
1. 1) R. Marchetti, C. Lacava, L. Carroll, K. Gradkowski, and P. Minzioni: "Coupling strategies for silicon photonics integrated chips," Photonics Research, Vol. 7, No. 2, pp. 201–239, 2019
2. 2) A. Noriki, T. Amano, D. Shimura, Y. Onawa, H. Yaegashi, H. Sasaki, and M. Mori: "45-degree curved micro-mirror for vertical optical I/O of silicon photonics chip," Optics Express, Vol. 27, No. 14, pp. 19749–19757, 2019
3. 3) K. Vanmol, K. Saurav, V. Panapakkam, H. Thienpont, N. Vermeulen, J. Watté, and J. Van Erps: "Mode-field Matching Down-Tapers on Single-Mode Optical Fibers for Edge Coupling Towards Generic Photonic Integrated Circuit Platforms," Journal of lightwave technology, Vol. 38, No. 17, pp. 4834–4842, 2020
4. 4) N. Mangal, B. Snyder, J. V. Campenhout, G. V. Steenberge, and J. Missinne: "Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling," Optics Express, Vol. 29, No. 5, pp. 7601–7615, 2021
5. 5) Y. Saito, K. Shikama, T. Tsuchizawa, H. Nishi, A. Aratake, and N. Sato: "Tapered Self-Written Waveguide between Silicon Photonics Chip and Standard Single-Mode Fiber," OFC 2020, W1 A.2, 2020
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