Acid Copper Plating in Surface Technology
Author:
Affiliation:
1. R&D Center, JCU CORPORATION
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/25/3/25_196/_pdf
Reference12 articles.
1. 1) Jisso技術ロードマップ専門委員会：“プリント配線板技術ロードマップ，”日本電子回路工業会，2021
2. 2) 近藤和夫：“初歩から学ぶ微小めっき技術，”工業調査会，pp. 46–56, 2004
3. 3) M. Tan, C. Guymon, D. R. Wheeler, and J. N. Harb: "The Role of SPS, MPSA, and Chloride in Additive Systems for Copper Electrodeposition," Journal of The Electrochemical Society, Vol. 154, No. 2, pp. 78–81, 2007
4. 4) W. P. Dow, Y. D. Chiu, and M. Y. Yen: "Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide," Journal of The Electrochemical Society, Vol. 156, No. 4, pp. 155–167, 2009
5. 5) M. Yokoi, S. Konishi, and T. Hayashi: "Absorption Behavior of Polyoxyethyleneglycole on the Copper Surface in an Acid Copper Sulfate Bath," Denki Kagaku oyobi Kogyo Butsuri Kagaku, Vol. 52, pp. 218–223, 1984
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