Self-Written Waveguide for Optical Connection between Silicon Photonics Chips and Standard Single-Mode Fibers
Author:
Affiliation:
1. NTT Device Technology Labs., NTT Corporation
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/25/2/25_172/_pdf
Reference11 articles.
1. 1) K. Hosseini, et al.: "8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO," Proc. Optical Fiber Communication Conf., Th4A.2, June 2021
2. 2) S. Fathololoumi, et al.: "1.6Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications," Proc. Optical Fiber Communication Conf., T3H.1, Mar. 2020
3. 3) T. Barwicz, et al.: "A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities," IEEE Journal on Selected Topics in Quantum Electronics, Vol. 22, No. 6, pp. 455–466, Nov.–Dec. 2016
4. 4) 齊藤洋平，他：“自己形成テーパー導波路によるシングルモードファイバ間光接続，”電子情報通信学会ソサイエティ大会，C-3-38，2019年9月
5. 5) Y. Saito, et al.: "Tapered Self-Written Waveguide between Silicon Photonics Chip and Standard Single-Mode Fiber," Proc. Optical Fiber Communication Conf., W1A.2, Mar. 2020
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