Plasma Etching Technology for Advanced Packaging to Lead Moore’s Law-Reference-Cited by-同舟云学术

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Plasma Etching Technology for Advanced Packaging to Lead Moore’s Law

Published:2022-01-01 Issue:1 Volume:25 Page:47-53
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/25/1/25_47/_pdf

Reference31 articles.

1. 1) IDC global dataSphere Forecast,https://www.idc.com/getdoc.jsp?containerId=prUS46286020

2. 2) 野村総合研究所金融ITフォーカス 2016年9月号

3. 3) K. Ichikawa: 17^th IC packaging technology Expo 2016, ICP-1

4. 4) S. Kumar: "Challenges in large scale training of Giant Transformers on Google TPU machines," HotChips 33 Tutorial 1, August 22nd, 2021

5. 5) DARPA: https://www.darpa.mil/news-events/2017-08-25

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A novel plasma etching technology of RIE-lag free TSV and dicing processes for 3D chiplets interconnect;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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