A QSFP28 AOC Employing Solderable 28-Gb/s × 4-Channel Transceiver Modules

Author:

Nasu Hideyuki1,Nagashima Kazuya1,Ishikawa Yozo1,Izawa Atsushi1,Nekado Yoshinobu1,Kise Tomofumi1

Affiliation:

1. Furukawa Electric Co., Ltd.

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Reference20 articles.

1. 1) Cisco Global Cloud Index; Forecast and Methodology, 2016-2021, White Paper, Jan. 2018. https://www.cisco.com/c/en/us/solutions/collateral/service-provider/global-cloud-index-gci/white-paper-c11-738085.html

2. 2) Ethernet Fabrics for the Cloud: Setting the Stage for the Next-Generation Data Center, White Paper, Mar. 2011. https://www.govexec.com/media/gbc/docs/idc_ethernet_fabric_federal_intro_final.pdf

3. 3) Cisco Data Center Spine-and-Leaf Architecture: Design Overview, White Paper, Mar. 2017. https://www.cisco.com/c/en/us/products/collateral/switches/nexus-7000-series-switches/white-paper-c11-737022.pdf

4. 5) SFF Committee: "SFF-8661, Specification for QSFP+ 4X Pluggable Module," Revision 2.3, Sept. 2014

5. 6) InfiniBand Trade Association: "120 Gb/s 12x Small Form-factor Pluggable (CXP)," Supplement to InfiniBand Archtecture Specification Volume 2 Release 1.2.1 Sept. 2009

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